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Intel Xeon W-3175X processor 3.1 GHz Box 38.5 MB Smart Cache
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Processor
Processor base frequency
3.1 GHz
Processor manufacturer
Intel
Cooler included
Yes
Processor codename
Skylake
Thermal Design Power (TDP)
255 W
Processor cache
38.5 MB
Processor ARK ID
189452
Processor model
W-3175X
Processor threads
56
System bus rate
8 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.8 GHz
Bus type
DMI3
Component for
PC
Processor lithography
14 nm
Processor family
Intel® Xeon®
Processor cores
28
Box
Yes
Processor socket
FCLGA3647
Processor cache type
Smart Cache
Memory
Maximum internal memory supported by processor
512 GB
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2666 MHz
Supported memory types
DDR4-SDRAM
Memory channels
Hexa-channel
ECC
Yes
Graphics
On-board graphics adapter
No
Power
Thermal Design Power (TDP)
255 W
Technical details
Intel TSX-NI
Yes
Intel® Turbo Boost Technology
2.0
Intel Trusted Execution Technology
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® AES New Instructions (Intel® AES-NI)
Yes
Execute Disable Bit
Yes
Enhanced Intel SpeedStep Technology
Yes
PCI Express slots version
3.0
Supported instruction sets
SSE4.2-AVX-AVX 2.0-AVX-512
Scalability
1S
Intel VT-x with Extended Page Tables (EPT)
Yes
Embedded options available
No
CPU configuration (max)
1
Product type
Processor
Processor cache
39424 KB
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Intel 64
Yes
Thermal Design Power (TDP)
255 W
Supported memory types
DDR4-SDRAM
Status
Launched
Market segment
Desktop
Launch date
Q4'18
Intel Virtualization Technology (VT-x)
Yes
Processor cache type
Smart Cache
Bus type units
GT/s
Bus bandwidth
8
Maximum memory
512 GB
Intel TSX-NI version
1.00
Processor brand name
Intel Xeon
Last change
63903513
Product family
Intel Xeon Processors
Intel® Speed Shift Technology version
1.00
Memory speed (max)
2666 MHz
Intel® Volume Management Device (VMD) version
1.00
AVX-512 Fused Multiply-Add (FMA) units
2
Bus speed
8 GT/s
Features
Maximum number of PCI Express lanes
48
Thermal Design Power (TDP)
255 W
Processor package size
76mm x 56.5mm
Processor ARK ID
189452
Execute Disable Bit
Yes
PCI Express slots version
3.0
Supported instruction sets
SSE4.2-AVX-AVX 2.0-AVX-512
Scalability
1S
Embedded options available
No
CPU configuration (max)
1
Market segment
Desktop
Harmonized System (HS) code
8542310001
Export Control Classification Number (ECCN)
5A992C
Commodity Classification Automated Tracking System (CCATS)
G077159
PCI Express CEM revision
3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Intel 64
Yes
Intel Turbo Boost Max Technology 3.0
No
Intel® Speed Shift Technology
Yes
Intel® Optane⢠Memory Ready
No
Intel TSX-NI
Yes
Intel® Turbo Boost Technology
2.0
Intel Trusted Execution Technology
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® AES New Instructions (Intel® AES-NI)
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel TSX-NI version
1.00
AVX-512 Fused Multiply-Add (FMA) units
2
Intel® Boot Guard
Yes
Intel® Volume Management Device (VMD)
Yes
Intel® vPro⢠Platform Eligibility
Yes
Intel® Transactional Synchronization Extensions
Yes
Operational conditions
Tjunction
85 °C
Tcase
70 °C
Packaging data
Package width
104 mm
Package depth
130 mm
Package height
45 mm
Package weight
322 g
Package type
Retail box
Weight & dimensions
Processor package size
76mm x 56.5mm
Package width
104 mm
Package depth
130 mm
Package height
45 mm
Package weight
322 g
Other features
Maximum internal memory
524288 MB
Maximum internal memory
512 GB
CPU configuration (max)
1
Intel Xeon W-3175X processor 3.1 GHz Box 38.5 MB Smart Cache
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